Resumen
ISO/TS 10303-1685:2006 specifies the application module for Interconnect module to assembly module relationship.
The following are within the scope of ISO/TS 10303-1685:2006:
- assembly requirement for interconnect substrate;
- assembly component based symbol placement in substrate requirement;
- assembly component based annotation text placement in substrate requirement;
- assembly component feature to layout feature requirement relationship;
- external references for assembly component;
- external references for assembly component feature;
Informaciones generales
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Estado: RetiradaFecha de publicación: 2006-12Etapa: Retirada de la Norma Internacional [95.99]
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Edición: 1Número de páginas: 42
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Comité Técnico :ISO/TC 184/SC 4ICS :25.040.40
- RSS actualizaciones
Ciclo de vida
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Ahora
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Revisada por
RetiradaISO/TS 10303-1685:2010