Reference number
ISO/TS 10303-1754:2010
© ISO 2024
Technical Specification
ISO/TS 10303-1754:2010
Industrial automation systems and integration — Product data representation and exchange — Part 1754: Application module: Via component
Edition 2
2010-03
Technical Specification
Preview
No disponible en español
Publicado (Edición 2, 2010)
Esta publicación se revisó y confirmó por última vez en 2022. Por lo tanto, esta versión es la actual.

Resumen

ISO/TS 10303-1754:2010-03 specifies the application module for Via component.

The following are within the scope of ISO/TS 10303-1754:2010-03:

  • blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
  • cylinder vias, where the cross-section shape is constant;
  • tapered vias, where the cross-section shape may vary as the vertical distance changes;
  • stacked vias, where multiple bind and buried vias share the same x y position;
  • filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
  • buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
  • interfacial connections, also known as through hole vias, which have both ends exposed;
  • items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
  • items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.

Informaciones generales

  • Estado
     : Publicado
    Fecha de publicación
     : 2010-03
    Etapa
    : Norma Internacional confirmada [90.93]
  • Edición
     : 2
    Número de páginas
     : 8
  • Comité Técnico :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
  • RSS actualizaciones

Añadir al carrito esta norma

Página de portada: STEP Module and Resource Library (SMRL) v10
STEP Module and Resource Library (SMRL) v10
This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

Ciclo de vida

¿Tiene alguna duda?

Consulte nuestras Ayuda y asistencia

  2. Tienda
  3. Standards catalogue
  4. ICS
  5. 25
  6. 25.040
  7. 25.040.40
  8. ISO/TS 10303-1754:2010