Reference number
ISO 9455-17:2002
© ISO 2024
ISO 9455-17:2002
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Edition 1
2002-12
Withdrawn
Withdrawn (Edition 1, 2002)

Abstract

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

General information

  • Status
     : Withdrawn
    Publication date
     : 2002-12
    Stage
    : Withdrawal of International Standard [95.99]
  • Edition
     : 1
    Number of pages
     : 21
  • Technical Committee :
    ISO/TC 44/SC 12
    ICS :
    25.160.50 
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