Reference number
ISO/TS 10303-1688:2010
© ISO 2024
Technical Specification
ISO/TS 10303-1688:2010
Industrial automation systems and integration — Product data representation and exchange — Part 1688: Application module: Interconnect non planar shape
Edition 2
2010-03
Technical Specification
Read sample
Published (Edition 2, 2010)
This publication was last reviewed and confirmed in 2022. Therefore this version remains current.

Abstract

ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape.

The following are within the scope of ISO/TS 10303-1688:2010-03:

  • three dimensional manifold surface representation of an interconnect substrate;
  • placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.

General information

  • Status
     : Published
    Publication date
     : 2010-03
    Stage
    : International Standard confirmed [90.93]
  • Edition
     : 2
    Number of pages
     : 8
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
  • RSS updates

Add to cart this standard

Cover page: STEP Module and Resource Library (SMRL) v10
STEP Module and Resource Library (SMRL) v10
This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

Life cycle

Got a question?

Check out our Help and Support

  2. Store
  3. Standards catalogue
  4. ICS
  5. 25
  6. 25.040
  7. 25.040.40
  8. ISO/TS 10303-1688:2010