Reference number
ISO/TS 10303-1689:2010
© ISO 2024
Technical Specification
ISO/TS 10303-1689:2010
Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation
Edition 2
2010-03
Withdrawn
Withdrawn (Edition 2, 2010)

Abstract

ISO/TS 10303-1689:2010-03 specifies the application module for Interconnect physical requirement allocation.

The following are within the scope of ISO/TS 10303-1689:2010-03:

  • thermal isolation requirement definition;
  • electrical isolation requirement definition;
  • thermal isolation template for substrate design;
  • electrical isolation template for substrate design;
  • length tolerance on spacing requirement;
  • allocation of an isolation requirement to a shield realized as part of an interconnect substrate.

General information

  • Status
     : Withdrawn
    Publication date
     : 2010-03
    Stage
    : Withdrawal of International Standard [95.99]
  • Edition
     : 2
    Number of pages
     : 8
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
  • RSS updates

Life cycle

Got a question?

Check out our Help and Support

  2. Store
  3. Standards catalogue
  4. ICS
  5. 25
  6. 25.040
  7. 25.040.40
  8. ISO/TS 10303-1689:2010