ISO/TS 10303-1685:2014 - Industrial automation systems and integration — Product data representation and exchange — Part 1685: Application module: Interconnect module to assembly module relationship

Withdrawn (Edition 3, 2014)

New version available: ISO/TS 10303-1685:2018

Abstract

ISO/TS 10303-1685:2014-02 specifies the application module for Interconnect module to assembly module relationship.

The following are within the scope of ISO/TS 10303-1685:2014-02:

assembly requirement for interconnect substrate;
assembly component based symbol placement in substrate requirement;
assembly component based annotation text placement in substrate requirement;
assembly component feature to layout feature requirement relationship;
external references for assembly component;
external references for assembly component feature;

General information

Status
: Withdrawn

Publication date
: 2014-06

Stage
: Withdrawal of International Standard [95.99]
Edition
: 3

Number of pages
: 11
Technical Committee :
ISO/TC 184/SC 4

ICS :
25.040.40
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