ISO/TS 10303-1689:2014 - Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation

Withdrawn (Edition 4, 2014)

New version available: ISO/TS 10303-1689:2018

Abstract

ISO/TS 10303-1689:2014-02 specifies the application module for Interconnect physical requirement allocation.

The following are within the scope of ISO/TS 10303-1689:2014-02:

thermal isolation requirement definition;
electrical isolation requirement definition;
thermal isolation template for substrate design;
electrical isolation template for substrate design;
length tolerance on spacing requirement;
allocation of an isolation requirement to a shield realized as part of an interconnect substrate.

General information

Status
: Withdrawn

Publication date
: 2014-06

Stage
: Withdrawal of International Standard [95.99]
Edition
: 4

Number of pages
: 11
Technical Committee :
ISO/TC 184/SC 4

ICS :
25.040.40
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