ISO/TS 10303-1698:2014 - Industrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module design

Withdrawn (Edition 5, 2014)

New version available: ISO/TS 10303-1698:2018

Abstract

ISO/TS 10303-1698:2014-08 specifies the application module for Layered interconnect module design.

The following are within the scope of ISO/TS 10303-1698:2014-08:

design features;
material stackup;
design patterns;
metalization;
functional and physical network listing;
design layers;
artwork layers;
passages;
items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
items within the scope of application module Component grouping, ISO/TS 10303-1656;
items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
items within the scope of application module Footprint definition, ISO/TS 10303-1646;
items within the scope of application module Land, ISO/TS 10303-1692;
items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.

General information

Status
: Withdrawn

Publication date
: 2014-08

Stage
: Withdrawal of International Standard [95.99]
Edition
: 5

Number of pages
: 11
Technical Committee :
ISO/TC 184/SC 4

ICS :
25.040.40
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