This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …
Abstract
ISO/TS 10303-1643:2018-11 specifies the application module for Assembly module with interconnect component.
The following are within the scope of ISO/TS 10303-1643:2018-11:
- assembly physical design;
- detailed specification of joined features of components in the design;
- detailed traceability of design requirements;
- as designed implementation of connection requirement;
- shape of assembly design;
- configuration management of assembly design;
- in-process change management of assembly design;
- interconnect substrates used as components in the assembly;
- items within the scope of application module Assembly module design, ISO/TS 10303-1636;
- items within the scope of application module Interconnect module usage view, ISO/TS 10303-1686;
- items within the scope of application module Interface component, ISO/TS 10303-1691.
General information
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Status: WithdrawnPublication date: 2018-11Stage: Withdrawal of International Standard [95.99]
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Edition: 4Number of pages: 11
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Technical Committee :ISO/TC 184/SC 4ICS :25.040.40
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Life cycle
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Previously
WithdrawnISO/TS 10303-1643:2014
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Now
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Revised by
PublishedISO/TS 10303-1643:2024
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