This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …
Abstract
ISO/TS 10303-1700:2018-11 specifies the application module for Layered interconnect module with printed component design.
The following are within the scope of ISO/TS 10303-1700:2018-11:
- printed components;
- routed printed components;
- printed connectors;
- items within the scope of application module Land, ISO/TS 10303-1692;
- items within the scope of application module Printed physical layout template, ISO/TS 10303-1737.
General information
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Status: PublishedPublication date: 2018-11Stage: International Standard confirmed [90.93]
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Edition: 5Number of pages: 11
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Technical Committee :ISO/TC 184/SC 4ICS :25.040.40
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Life cycle
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Previously
WithdrawnISO/TS 10303-1700:2014
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Now