ISO/TS 10303-1754:2006 - Systèmes d'automatisation industrielle et intégration — Représentation et échange de données de produits — Partie 1754: Module d'application: Composant Via

Annulée (Edition 1, 2006)

Nouvelle édition disponible : ISO/TS 10303-1754:2010

Résumé

ISO/TS 10303-1754:2006 specifies the application module for Via component.

The following are within the scope of ISO/TS 10303-1754:2006:

blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
cylinder vias, where the cross-section shape is constant;
tapered vias, where the cross-section shape may vary as the vertical distance changes;
stacked vias, where multiple bind and buried vias share the same x y position;
filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
interfacial connections, also known as through hole vias, which have both ends exposed;
items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.

Informations générales

État actuel
: Annulée

Date de publication
: 2006-12

Stade
: Annulation de la Norme internationale [95.99]
Edition
: 1
Comité technique :
ISO/TC 184/SC 4

ICS :
25.040.40
RSS mises à jour

Cycle de vie

Vous avez une question?

Consulter notre Aide et assistance