ISO/TS 10303-1716:2014 - Industrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex template

Withdrawn (Edition 4, 2014)

New version available: ISO/TS 10303-1716:2018

Abstract

ISO/TS 10303-1716:2014-02 specifies the application module for Layered interconnect complex template.

The following are within the scope of ISO/TS 10303-1716:2014-02:

footprint definition;
footprint definition shape;
padstack definition;
padstack definition shape;
items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.

General information

Status
: Withdrawn

Publication date
: 2014-06

Stage
: Withdrawal of International Standard [95.99]
Edition
: 4

Number of pages
: 11
Technical Committee :
ISO/TC 184/SC 4

ICS :
25.040.40
RSS updates

Life cycle

Got a question?

Check out our Help and Support