Reference number
ISO/TS 10303-1716:2018
© ISO 2024
Technical Specification
ISO/TS 10303-1716:2018
Industrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex template
Edition 5
2018-11
Technical Specification
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Published (Edition 5, 2018)
This publication was last reviewed and confirmed in 2022. Therefore this version remains current.

Abstract

ISO/TS 10303-1716:2018-11 specifies the application module for Layered interconnect complex template.

The following are within the scope of ISO/TS 10303-1716:2018-11:

  • footprint definition;
  • footprint definition shape;
  • padstack definition;
  • padstack definition shape;
  • items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
  • items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.

General information

  • Status
     : Published
    Publication date
     : 2018-11
    Stage
    : International Standard confirmed [90.93]
  • Edition
     : 5
    Number of pages
     : 11
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
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Cover page: STEP Module and Resource Library (SMRL) v10
STEP Module and Resource Library (SMRL) v10
This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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