Abstract
ISO/TS 10303-1741:2014-02 specifies the application module for Sequential laminate assembly design.
The following are within the scope of ISO/TS 10303-1741:2014-02:
- sequence of application of an embedded component;
- sequence of material buildup or lamination;
- support for embedded component location;
- items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
General information
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Status: WithdrawnPublication date: 2014-06Stage: Withdrawal of International Standard [95.99]
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Edition: 4Number of pages: 11
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Technical Committee :ISO/TC 184/SC 4ICS :25.040.40
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Life cycle
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Previously
WithdrawnISO/TS 10303-1741:2010
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Now
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Revised by
PublishedISO/TS 10303-1741:2018